Oberg Industries is launching what it calls the world’s most advanced grinding technology with its Molecular Decomposition Process™ (MDP™).
Developed for the most efficient removal or cutting of any conductive material, MDP uses an electrochemical action and an abrasive wheel to achieve surface finish of less than 1 RA and precision tolerances held to ± 0.0002″ – all without generating heat.
Oberg says the process is ideal for use with consumer or industrial products where surface finish and dimensional stability are imperative such as grinding surgical needles, sharps and razor blades. Molecular Decomposition Process is also suitable for applications requiring a surface free of micro cracks and fissures or other highly polished weight bearing and articulating surfaces. Gentle enough to grind thin-walled components without damage or distortion, MDP works well with tubing, rapid cut-off needs and grinding of complex features in exotic metals including nitinol.
During Molecular Decomposition Process, an electric current flows between the negatively charged abrasive wheel and the positively charged work piece through an environmentally friendly electrolyte (saline) solution. A decomposing action occurs causing the material surface to oxidize. This oxidized surface is then removed by the specially formulated abrasives in the wheel exposing more material and repeating the cycle.
MDP cuts conductive materials 80 percent faster than conventional methods and is especially effective on super-alloys and exotic metals.
